AD9785-DPG2-EBZ View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
AD9785-DPG2-EBZ Datasheet PDF : 62 Pages
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AD9785/AD9787/AD9788
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVDD33 to AGND, DGND, CGND
DVDD33, DVDD18, CVDD18
to AGND, DGND, CGND
AGND to DGND, CGND
DGND to AGND, CGND
CGND to AGND, DGND
I120, VREF, IPTAT to AGND
OUT1_P, OUT1_N, OUT2_P, OUT2_N,
AUX1_P, AUX1_N, AUX2_P,
AUX2_N to AGND
P1D[15] to P1D[0], P2D[15] to P2D[0]
to DGND
DATACLK, TXENABLE to DGND
REFCLK+, REFCLK−, RESET, IRQ,
PLL_LOCK, SYNC_O+, SYNC_O−,
SYNC_I+, SYNC_I− to CGND
RESET, IRQ, PLL_LOCK, SYNC_O+,
SYNC_O−, SYNC_I+, SYNC_I−,
SPI_CS, SCLK, SPI_SDIO, SPI_SDO
to DGND
Junction Temperature
Storage Temperature Range
Rating
−0.3 V to +3.6 V
−0.3 V to +2.1 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD33 + 0.3 V
−1.0 V to AVDD33 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
−0.3 V to CVDD18 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
125°C
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Data Sheet
THERMAL RESISTANCE
For this 100-lead, thermally enhanced TQFP, the exposed pad
(EPAD) must be soldered to the ground plane. Note that these
specifications are valid with no airflow movement.
Table 5. Thermal Resistance
Resistance Unit
Conditions
θJA
19.1°C/W EPAD soldered. No airflow.
θJB
12.4°C/W EPAD soldered. No airflow.
θJC
7.1°C/W EPAD soldered. No airflow.
ESD CAUTION
Rev. C | Page 6 of 62
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