K20P121M100SF2V2 View Datasheet(PDF) - NXP Semiconductors.
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Description
Manufacturer
K20P121M100SF2V2 Datasheet PDF : 80 Pages
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Table of Contents
1 Ordering parts...........................................................................5
6 Peripheral operating requirements and behaviors....................24
1.1 Determining valid orderable parts......................................5
6.1 Core modules....................................................................24
2 Part identification......................................................................5
6.1.1 Debug trace timing specifications.......................24
2.1 Description.........................................................................5
6.1.2 JTAG electricals..................................................25
2.2 Format...............................................................................5
6.2 System modules................................................................28
2.3 Fields.................................................................................5
6.3 Clock modules...................................................................28
2.4 Example............................................................................6
6.3.1 MCG specifications.............................................28
3 Terminology and guidelines......................................................6
6.3.2 Oscillator electrical specifications.......................30
3.1 Definition: Operating requirement......................................6
6.3.3 32 kHz oscillator electrical characteristics..........33
3.2 Definition: Operating behavior...........................................7
6.4 Memories and memory interfaces.....................................33
3.3 Definition: Attribute............................................................7
6.4.1 Flash electrical specifications.............................33
3.4 Definition: Rating...............................................................8
6.4.2 EzPort switching specifications...........................38
3.5 Result of exceeding a rating..............................................8
6.4.3 Flexbus switching specifications.........................39
3.6 Relationship between ratings and operating
6.5 Security and integrity modules..........................................42
requirements......................................................................8
6.6 Analog...............................................................................42
3.7 Guidelines for ratings and operating requirements............9
6.6.1 ADC electrical specifications..............................42
3.8 Definition: Typical value.....................................................9
6.6.2 CMP and 6-bit DAC electrical specifications......50
3.9 Typical value conditions....................................................10
6.6.3 12-bit DAC electrical characteristics...................53
4 Ratings......................................................................................11
6.6.4 Voltage reference electrical specifications..........56
4.1 Thermal handling ratings...................................................11
6.7 Timers................................................................................57
4.2 Moisture handling ratings..................................................11
6.8 Communication interfaces.................................................57
4.3 ESD handling ratings.........................................................11
6.8.1 USB electrical specifications...............................57
4.4 Voltage and current operating ratings...............................11
6.8.2 USB DCD electrical specifications......................58
5 General.....................................................................................12
6.8.3 USB VREG electrical specifications...................58
5.1 AC electrical characteristics..............................................12
6.8.4 CAN switching specifications..............................59
5.2 Nonswitching electrical specifications...............................12
6.8.5 DSPI switching specifications (limited voltage
5.2.1 Voltage and current operating requirements......13
range).................................................................59
5.2.2 LVD and POR operating requirements...............14
6.8.6 DSPI switching specifications (full voltage
5.2.3 Voltage and current operating behaviors............14
range).................................................................60
5.2.4 Power mode transition operating behaviors.......16
6.8.7 Inter-Integrated Circuit Interface (I2C) timing..... 62
5.2.5 Power consumption operating behaviors............17
6.8.8 UART switching specifications............................63
5.2.6 EMC radiated emissions operating behaviors....20
6.8.9 SDHC specifications...........................................63
5.2.7 Designing with radiated emissions in mind.........21
6.8.10 I2S/SAI switching specifications.........................64
5.2.8 Capacitance attributes........................................21
6.9 Human-machine interfaces (HMI)......................................71
5.3 Switching specifications.....................................................21
6.9.1 TSI electrical specifications................................71
5.3.1 Device clock specifications.................................21
7 Dimensions...............................................................................72
5.3.2 General switching specifications.........................22
7.1 Obtaining package dimensions.........................................72
5.4 Thermal specifications.......................................................23
8 Pinout........................................................................................72
5.4.1 Thermal operating requirements.........................23
8.1 K20 signal multiplexing and pin assignments....................72
5.4.2 Thermal attributes...............................................23
8.2 K20 pinouts.......................................................................77
K20 Sub-Family Data Sheet, Rev. 3, 6/2013.
Freescale Semiconductor, Inc.
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