STPS3150UF View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS3150UF Datasheet PDF : 10 Pages
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STPS3150
Characteristics
Figure 15.
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, eCU = 35 µm) (SMB)
Rth(j-a)(°C/W)
110
100
SMB
90
80
70
60
50
40
30
20
10
SCu(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 16.
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, eCU = 35 µm)
(DO-201AD)
Rth(°C/W)
90
80
70
60
50
40
30
20
10
0
5
10
Rth(j-a)
DO-201AD
Rth(j-I)
Lleads(mm)
15
20
25
Figure 17.
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, eCU = 35 µm) (SMB flat)
Rth(j-a)(°C/W)
110
100
90
80
70
60
50
SMB flat
40
30
20
10
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
5/10
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