STPCI2GDYI(2002) Ver la hoja de datos (PDF) - STMicroelectronics

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STPCI2GDYI
(Rev.:2002)

X86 Core PC Compatible System-on-Chip for Terminals

STMicroelectronics 

MECHANICAL DATA

5.2. 516-PIN PACKAGE THERMAL DATA

The structure in shown in Figure 5-4.

516-pin PBGA package has a Power Dissipation

Capability of 4.5W which increases to 6W when

used with a Heatsink.

Thermal dissipation options are illustrated in

Figure 5-5 and Figure 5-6.

Figure 5-4. 516-Pin PBGA Structure

Signal layers

Power & Ground layers

Thermal balls

Figure 5-5. Thermal Dissipation Without Heatsink

Board

Ambient

Case

Junction

Board

Ambient

Junction

Board dimensions:

- 10.2 cm x 12.7 cm

Rca

- 4 layers (2 for signals, 1 GND, 1VCC)

6

6

The PBGA is centred on board

Rjc

Board

8.5

Rjb

Case

125

There are no other devices

1 via pad per ground ball (8-mil wire)

40% copper on signal layers

Copper thickness:

Rba

Ambient

- 17µm for internal layers

- 34µm for external layers

Rja = 13 °C/W

Airflow = 0

Board temperature taken at the centre balls

72/111

Issue 1.0 - July 24, 2002

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