LC4256ZC-45T100AIES Ver la hoja de datos (PDF) - Lattice Semiconductor

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Fabricante

LC4256ZC-45T100AIES

3.3V/2.5V/1.8V In-System Programmable SuperFAST High Density PLDs

Lattice Semiconductor 

Lattice Semiconductor

ispMACH 4000V/B/C/Z Family Data Sheet

Signal Descriptions

Signal Names

Description

TMS

Input – This pin is the IEEE 1149.1 Test Mode Select input, which is used to control

the state machine.

TCK

Input – This pin is the IEEE 1149.1 Test Clock input pin, used to clock through the

state machine.

TDI

Input – This pin is the IEEE 1149.1 Test Data In pin, used to load data.

TDO

Output – This pin is the IEEE 1149.1 Test Data Out pin used to shift data out.

GOE0/IO, GOE1/IO

These pins are configured to be either Global Output Enable Input or as general I/O

pins.

GND

Ground

NC

Not Connected

VCC

CLK0/I, CLK1/I, CLK2/I, CLK3/I

The power supply pins for logic core and JTAG port.

These pins are configured to be either CLK input or as an input.

VCCO0, VCCO1

The power supply pins for each I/O bank.

Input/Output1 – These are the general purpose I/O used by the logic array. y is GLB

reference (alpha) and z is macrocell reference (numeric). z: 0-15.

ispMACH 4032

y: A-B

ispMACH 4064

y: A-D

yzz

ispMACH 4128

y: A-H

ispMACH 4256

y: A-P

ispMACH 4384

y: A-P, AX-HX

ispMACH 4512

y: A-P, AX-PX

1. In some packages, certain I/Os are only available for use as inputs. See the signal connections table for details.

ispMACH 4000V/B/C ORP Reference Table

4032V/B/C 4064V/B/C

4128V/B/C

4256V/B/C

4384V/B/C 4512V/B/C

Number of I/Os 301 32 302 32 64

64 923 96 64

964

128

160 128 192 128

208

Number of GLBs 2 2 4 4

4

8

8 8 16

16

16

16

16 16 16

16

Number of I/Os /

GLB

16

16

8

8

16

8 12 12 4

8

8

10

88

8

Mixture

of 8 & 45

Reference ORP

Table

16 I/Os /

GLB

8 I/Os / 16 I/Os / 8 I/Os / 12 I/Os / 4 I/Os / 8 I/Os / 8 I/Os / 10 I/Os /

GLB

GLB GLB GLB GLB GLB GLB GLB

8 I/Os /

GLB

8 I/Os /

GLB

8 I/Os /

GLB

4 I/Os /

GLB

1. 32-macrocell device, 44 TQFP: 2 GLBs have 15 out of 16 I/Os bonded out.

2. 64-macrocells device, 44 TQFP: 2 GLBs have 7 out of 8 I/Os bonded out.

3. 128-macrocell device, 128 TQFP: 4 GLBs have 11 out of 12 I/Os

4. 256-macrocell device, 144 TQFP: 16 GLBs have 6 I/Os per

5. 512-macrocell device: 20 GLBs have 8 I/Os per, 12 GLBs have 4 I/Os per

ispMACH 4000Z ORP Reference Table

4032Z

4064Z

Number of I/Os

32

32

64

Number of GLBs

2

4

4

Number of I/Os / GLB

16

8

16

Reference ORP Table

16 I/Os /

GLB

8 I/Os /

GLB

16 I/Os /

GLB

1. 256-macrocell device, 132 csBGA: 16 GLBs have 6 I/Os per

4128Z

64

96

8

8

8

12

8 I/Os /

GLB

12 I/Os /

GLB

64

16

4

4 I/Os /

GLB

4256Z

961

16

8

8 I/Os /

GLB

128

16

8

8 I/Os /

GLB

42

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