STM32L152CBH6DTR(2013) Ver la hoja de datos (PDF) - STMicroelectronics
Número de pieza
componentes Descripción
Fabricante
STM32L152CBH6DTR
(Rev.:2013)
(Rev.:2013)
STMicroelectronics
STM32L152CBH6DTR Datasheet PDF : 121 Pages
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Electrical characteristics
STM32L151x6/8/B, STM32L152x6/8/B
Figure 27. Maximum dynamic current consumption on VREF+ supply pin during ADC
conversion
Sampling (n cycles)
ADC clock
Iref+
700µA
300µA
Conversion (12 cycles)
Table 56.
Ts
(cycles)
RAIN max for fADC = 16 MHz(1)
RAIN max (kohm)
Ts
(µs)
Multiplexed channels
Direct channels
2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.3 V 1.8 V < VDDA < 2.4 V
4
0.25
Not allowed
Not allowed
0.7
Not allowed
9
0.5625
0.8
Not allowed
2.0
1.0
16
1
2.0
0.8
4.0
3.0
24
1.5
3.0
1.8
6.0
4.5
48
3
6.8
4.0
15.0
10.0
96
6
15.0
10.0
30.0
20.0
192
12
32.0
25.0
50.0
40.0
384
24
50.0
50.0
50.0
50.0
1. Guaranteed by design, not tested in production.
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 28 or Figure 29,
depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be
ceramic (good quality). They should be placed as close as possible to the chip.
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Doc ID 17659 Rev 8
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