STPS1150M(2011) Ver la hoja de datos (PDF) - STMicroelectronics
Número de pieza
componentes Descripción
Fabricante
STPS1150M Datasheet PDF : 11 Pages
| |||
STPS1150
Characteristics
Figure 13. Reverse leakage current versus
reverse voltage applied (typical
values)
IR(µA)
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
0
Tj=150°C
Tj=125°C
Tj=100°C
Tj=75°C
Tj=50°C
Tj=25°C
VR(V)
25
50
75
100
125
150
Figure 14. Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
100
F=1MHz
VOSC=30mVRMS
Tj=25°C
10
VR(V)
1
1
10
100
1000
Figure 15. Forward voltage drop versus
forward current (all packages)
IFM(A)
3.0
2.5
Tj=125°C
(maximum values)
2.0
1.5
Tj=125°C
(typical values)
1.0
Tj=25°C
(maximum values)
0.5
VFM(V)
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Figure 16. Thermal resistance junction to
ambient versus copper surface
under tab (STmite)
Rth(j-a)(°C/W)
250
225
STmite
200
175
Epoxy printed circuit board,
150
copper thickness = 35 µm
125
100
75
50
25
0
SCu(cm²)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 17. Thermal resistance junction to
ambient versus copper surface
under tab (STmite flat)
250 Rth(j-a)(°C/W)
225
STmite flat
200
175
Epoxy printed circuit board,
150
copper thickness = 35 µm
125
100
75
50
25
SCu(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 18. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
Rth(j-a)(°C/W)
130
120
110
100
90
80
70
60
50
40
30
20
10
0
0.0 0.5 1.0 1.5
Epoxy printed circuit board,
copper thickness = 35 µm
SCu(cm²)
2.0 2.5 3.0 3.5 4.0 4.5 5.0
Doc ID 9472 Rev 5
5/11
Share Link: 