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STM32WB55CCU7 Ver la hoja de datos (PDF) - STMicroelectronics

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STM32WB55CCU7 Datasheet PDF : 193 Pages
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Package information
STM32WB55xx STM32WB35xx
Table 101. UFBGA129 recommended PCB design rules
Dimension
Recommended values
Pitch
0.5 mm
Dpad
Dsm
Stencil opening
Stencil thickness
0,360 mm
0.460 mm typ. (depends on soldermask registration tolerance)
0.360 mm
0.100 mm
Device marking for UFBGA129
Figure 40 gives an example of topside marking orientation versus pin 1 identifier location.
The printed markings may differ depending on the supply chain.
Other optional marking or inset/upset marks, which identify the parts throughout supply
chain operations, are not indicated below.
Figure 40. UFBGA129 marking example (package top view)
Product identification(1)
STM32WB
55V
Y WW Y
Additional
information
Pin 1 identifier
Date code
MS53511V1
1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified
and therefore not approved for use in production. ST is not responsible for any consequences resulting
from such use. In no event will ST be liable for the customer using any of these engineering samples in
production. ST’s Quality department must be contacted prior to any decision to use these engineering
samples to run a qualification activity.
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DS11929 Rev 10

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