STPCI2GDYI データシートの表示（PDF） - STMicroelectronics

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STPCI2GDYI

X86 CORE PC COMPATIBLE SYSTEM-ON-CHIP FOR TERMINALS

STMicroelectronics 

STPC® ATLAS

6.5.2. THERMAL DISSIPATION

6.5.2.1. Power saving

Thermal dissipation of the STPC depends mainly

on supply voltage. When the system does not

need to work at the upper voltage limit, it may

therefore be beneficial to reduce the voltage to the

lower voltage limit, where possible. This could

save a few 100’s of mW.

With such configuration the Plastic BGA package

does 90% of the thermal dissipation through the

ground balls, and especially the central thermal

balls which are directly connected to the die. The

remaining 10% is dissipated through the case.

Adding a heat sink reduces this value to 85%.

As a result, some basic rules must be followed

when routing the STPC in order to avoid thermal

problems.

The second area to look at is unused interfaces As the whole ground layer acts as a heat sink, the

and functions. Depending on the application, ground balls must be directly connected to it, as

some input signals can be grounded, and some illustrated in Figure 5-2. If one ground layer is not

blocks not powered or shutdown. Clock speed enough, a second ground plane may be added.

dynamic adjustment is also a solution that can be

used along with the integrated power When possible, it is important to avoid other

management unit.

devices on-board using the PCB for heat

dissipation, like linear regulators, as this would

6.5.2.2. Thermal balls

t(s) The standard way to route thermal balls to ground

layer implements only one via pad for each ball

c pad, connected using a 8-mil wire.

du Figure 6-31. Ground Routing

heat the STPC itself and reduce the temperature

range of the whole system, In case these devices

can not use a separate heat sink, they must not be

located just near the STPC

te Pro Pad for ground ball

ole Thru hole to ground layer

duct(s) - Obs TPoopwLearyleary:eSrignals

Pro Internal

Obsolete Bottom

Layer:

Layer:

Signals

Ground

layer

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