STPCC0166BTC3 データシートの表示（PDF） - STMicroelectronics

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STPCC0166BTC3

PC Compatible Embeded Microprocessor

STMicroelectronics 

Figure 5-6. Thermal dissipation with heatsink

MECHANICAL DATA

Board

Ambient

Case

Junction

Board

Ambient

Junction

Rca

3

Rjc

Board

6

Case

8.5

50

Rjb

Rba

Ambient

Rja = 9.5 °C/W

Board dimensions:

- 10.2 cm x 12.7 cm

- 4 layers (2 for signals, 1 GND, 1VCC)

The PBGA is centered on board

There are no other devices

1 via pad per ground ball (8-mil wire)

40% copper on signal layers

Copper thickness:

- 17µm for internal layers

- 34µm for external layers

Airflow = 0

Board temperature taken at the center balls

Heat sink is 11.1°C/W

Issue 1.2

41/51

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