PIC16F882T-I/SSQTP データシートの表示（PDF） - Microchip Technology

部品番号

コンポーネント説明

メーカー

PIC16F882T-I/SSQTP

28/40/44-Pin Flash-Based, 8-Bit CMOS Microcontrollers

Microchip Technology 

PIC16F882/883/884/886/887

17.6 Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +125°C

Param

No.

Sym.

Characteristic

Typ. Units

Conditions

TH01

TH02

TH03

TH04

TH05

TH06

TH07

Note 1:

2:

3:

JA

Thermal Resistance

Junction to Ambient

47.2

C/W 40-pin PDIP package

24.4

C/W 44-pin QFN package

45.8

C/W 44-pin TQFP package

60.2

C/W 28-pin PDIP package

80.2

C/W 28-pin SOIC package

89.4

C/W 28-pin SSOP package

29

C/W 28-pin QFN package

JC

Thermal Resistance

Junction to Case

24.7

C/W 40-pin PDIP package

20.0

C/W 44-pin QFN package

14.5

C/W 44-pin TQFP package

29

C/W 28-pin PDIP package

23.8

C/W 28-pin SOIC package

23.9

C/W 28-pin SSOP package

20.0

C/W 28-pin QFN package

TJ

Junction Temperature

150

C For derated power calculations

PD

Power Dissipation

—

W PD = PINTERNAL + PI/O

PINTERNAL Internal Power Dissipation

—

W

PINTERNAL = IDD x VDD

(NOTE 1)

PI/O

I/O Power Dissipation

—

W PI/O =  (IOL * VOL) +  (IOH * (VDD -

VOH))

PDER

Derated Power

—

W PDER = (TJ - TA)/JA

(NOTE 2, 3)

IDD is current to run the chip alone without driving any load on the output pins.

TA = Ambient Temperature.

Maximum allowable power dissipation is the lower value of either the absolute maximum total power

dissipation or derated power (PDER).

 2006-2012 Microchip Technology Inc.

DS41291G-page 257

Share Link: