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STM32F103V8H6TR データシートの表示(PDF) - STMicroelectronics

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STM32F103V8H6TR Datasheet PDF : 123 Pages
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Electrical characteristics
STM32F103xC, STM32F103xD, STM32F103xE
Table 62. DAC characteristics (continued)
Symbol
Parameter
Min Typ
Max
Offset error
±10
(difference between
Offset(2) measured value at Code
±3
(0x800) and the ideal value =
VREF+/2)
±12
Gain
error(2)
Gain error
±0.5
Settling time (full scale: for a
10-bit input code transition
tSETTLING(2)
between the lowest and the
highest input codes when
DAC_OUT reaches final
value ±1LSB
3
4
Max frequency for a correct
Update
rate(2)
DAC_OUT change when
small variation in the input
1
code (from code i to i+1LSB)
Wakeup time from off state
tWAKEUP(2) (Setting the ENx bit in the
DAC Control register)
6.5 10
Power supply rejection ratio
PSRR+ (1) (to VDDA) (static DC
measurement
–67 –40
1. Guaranteed by design, not tested in production.
2. Guaranteed by characterization, not tested in production.
Unit
Comments
mV
Given for the DAC in 12-bit
configuration
LSB
Given for the DAC in 10-bit at VREF+
= 3.6 V
LSB
Given for the DAC in 12-bit at VREF+
= 3.6 V
%
Given for the DAC in 12bit
configuration
µs CLOAD 50 pF, RLOAD 5 k
MS/s CLOAD 50 pF, RLOAD 5 k
CLOAD 50 pF, RLOAD 5 k
µs input code between lowest and
highest possible ones.
dB No RLOAD, CLOAD = 50 pF
Figure 57. 12-bit buffered /non-buffered DAC
Buffered/Non-buffered DAC
Buffer(1)
12-bit
digital to
analog
converter
DACx_OUT
R LOAD
C LOAD
ai17157
1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly
without the use of an external operational amplifier. The buffer can be bypassed by configuring the BOFFx bit in the
DAC_CR register.
104/123
Doc ID 14611 Rev 7

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