Package characteristics
STM32F103xC, STM32F103xD, STM32F103xE
Figure 62. Recommended PCB design rules (0.5 mm pitch BGA)
Dpad
Dsm
Dpad
0.37 mm
Dsm
0.52 mm typ. (depends on solder mask
registration tolerance
Solder paste 0.37 mm aperture diameter
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
ai15469
110/123
Doc ID 14611 Rev 7