LTC2264-14(RevB) データシートの表示（PDF） - Linear Technology

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LTC2264-14
(Rev.:RevB)

14-Bit, 65Msps/40Msps/25Msps Low Power Dual ADCs

Linear Technology 

LTC2265-14/

LTC2264-14/LTC2263-14

APPLICATIONS INFORMATION

GROUNDING AND BYPASSING

The LTC2265-14/LTC2264-14/LTC2263-14 requires a

printed circuit board with a clean unbroken ground plane.

A multilayer board with an internal ground plane in the

first layer beneath the ADC is recommended. Layout for

the printed circuit board should ensure that digital and

analog signal lines are separated as much as possible. In

particular, care should be taken not to run any digital track

alongside an analog signal track or underneath the ADC.

High quality ceramic bypass capacitors should be used at

the VDD, OVDD, VCM, VREF, REFH and REFL pins. Bypass

capacitors must be located as close to the pins as possible.

Of particular importance is the 0.1µF capacitor between

REFH and REFL. This capacitor should be on the same

side of the circuit board as the A/D, and as close to the

device as possible (1.5mm or less). Size 0402 ceramic

capacitors are recommended. The larger 2.2µF capacitor

between REFH and REFL can be somewhat further away.

The traces connecting the pins and bypass capacitors must

be kept short and should be made as wide as possible.

The analog inputs, encode signals and digital outputs

should not be routed next to each other. Ground fill and

grounded vias should be used as barriers to isolate these

signals from each other.

HEAT TRANSFER

Most of the heat generated by the LTC2265-14/LTC2264-

14/LTC2263-14 is transferred from the die through the bot-

tom-side Exposed Pad and package leads onto the printed

circuit board. For good electrical and thermal performance,

the Exposed Pad must be soldered to a large grounded

pad on the PC board. This pad should be connected to the

internal ground planes by an array of vias.

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