TCN75AVUA. データシートの表示（PDF） - Microchip Technology

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TCN75AVUA.

2-Wire Serial Temperature Sensor

Microchip Technology 

TCN75A

8-Lead Plastic Micro Small Outline Package (UA) (MSOP)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

E

E1

NOTE 1

12

e

b

c

A

A2

ϕ

A1

L1

L

Units

Dimension Limits

Number of Pins

N

Pitch

e

Overall Height

A

Molded Package Thickness A2

Standoff

A1

Overall Width

E

Molded Package Width

E1

Overall Length

D

Foot Length

L

Footprint

L1

Foot Angle

ϕ

Lead Thickness

c

Lead Width

b

MILLIMETERS

MIN

NOM

8

0.65 BSC

—

—

0.75

0.85

0.00

—

4.90 BSC

3.00 BSC

3.00 BSC

0.40

0.60

0.95 REF

0°

—

0.08

—

0.22

—

MAX

1.10

0.95

0.15

0.80

8°

0.23

0.40

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions

shall not exceed 0.15 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing No. C04–111, Sept. 8, 2006

© 2006 Microchip Technology Inc.

DS21935C-page 25

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