M24512-FDW6G(2018) データシートの表示（PDF） - STMicroelectronics
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M24512-FDW6G Datasheet PDF : 40 Pages
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Package information
M24512-W M24512-R M24512-DF
Table 19. UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch dual flat package,
no lead - package mechanical data (continued)
Symbol
millimeters
Min
Typ
Max
inches(1)
Min
Typ
Max
L
0.300
-
0.500
0.0118
-
0.0197
L1
-
-
0.150
-
-
0.0059
L3
0.300
-
-
0.0118
-
-
eee(2)
0.080
-
-
0.0031
-
-
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
9.2
TSSOP8 package information
Figure 16.TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,
package outline
ϴ
ϱ
Đ
ϭ
ϭ
ϰ
ɲ
W
ϭ
>
Ϯ
>ϭ
ď
Ğ
1. Drawing is not to scale.
76623$0B9
Table 20. TSSOP8 – 3 x 4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,
package mechanical data
Symbol
Min.
millimeters
Typ.
Max.
Min.
inches(1)
Typ.
Max.
A
-
-
1.200
-
-
0.0472
A1
0.050
-
0.150
0.0020
-
0.0059
A2
0.800
1.000
1.050
0.0315
0.0394
0.0413
b
0.190
-
0.300
0.0075
-
0.0118
c
0.090
-
0.200
0.0035
-
0.0079
34/47
DS6520 Rev 30
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