STM32F051R4T7TR データシートの表示（PDF） - STMicroelectronics
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STM32F051R4T7TR
STMicroelectronics
STM32F051R4T7TR Datasheet PDF : 122 Pages
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STM32F051x4 STM32F051x6 STM32F051x8
Package information
Figure 52. UFQFPN32 package outline
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1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device
ground and must be connected. It is referred to as pin 0 in Table: Pin definitions.
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