STM32F091xB STM32F091xC
Package information
Symbol
Table 73. UFBGA64 package mechanical data (continued)
millimeters
inches(1)
Min
Typ
Max
Min
Typ
A
0.460
0.530
0.600
0.0181
0.0209
ddd
-
-
0.080
-
-
eee
-
-
0.150
-
-
fff
-
-
0.050
-
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Max
0.0236
0.0031
0.0059
0.0020
Figure 40. Recommended footprint for UFBGA64 package
'SDG
'VP
$B)3B9
Table 74. UFBGA64 recommended PCB design rules
Dimension
Recommended values
Pitch
0.5
Dpad
0.280 mm
Dsm
0.370 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.280 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
Pad trace width
0.100 mm
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