TDA1170D データシートの表示（PDF） - STMicroelectronics
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TDA1170D Datasheet PDF : 8 Pages
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TDA1170D
MOUNTING INSTRUCTION
The Rth j-amb of the TDA 1170D can be reduced by
soldering the GND pins to a suitable copper area
of the printed circuit board (fig. 5) or to an external
heatsink (fig. 6).
The diagram of figure 7 shows the maximum dissi-
pable power Ptot and the Rth j-amb as a function of
Figure 5 : Example of P.C. Board Copper Area
which is Used as Heatsink
the side ”l” of two equal square copper areas having
a thickness of 35 µ (1.4 mils).
During soldering the pins temperature must not
exceed 260 °C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 6 : External Heatsink Mounting Example
Figure 7 : Maximum Dissipable Power and
Junction-Ambient Thermal
Resistance versus Side ”l”
Figure 8 : Maximum Allowable Power
Dissipation versus Ambient
Temperature
7/8
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