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ST62P20LB6/HWD 데이터 시트보기 (PDF) - STMicroelectronics

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ST62P20LB6/HWD Datasheet PDF : 105 Pages
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ST6208C/ST6209C/ST6210C/ST6220C
12.2 THERMAL CHARACTERISTICS
Symbol
RthJA
PD
TJmax
Ratings
Package thermal resistance (junction to ambient)
DIP20
SO20
SSOP20
Power dissipation 1)
Maximum junction temperature 2)
Value
60
80
115
500
150
Unit
°C/W
mW
°C
Notes:
1. The power dissipation is obtained from the formula PD = PINT + PPORT where PINT is the chip internal power (IDDxVDD)
and PPORT is the port power dissipation determined by the user.
2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.
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