PIC16CE623T-04EP 데이터 시트보기 (PDF) - Microchip Technology

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PIC16CE623T-04EP

OTP 8-Bit CMOS MCU with EEPROM Data Memory

Microchip Technology 

PIC16CE62X

14.0 PACKAGING INFORMATION

18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)

E1

W2

D

2

n

1

W1

E

A

A2

c

A1

eB

B1

B

L

p

Units

Dimension Limits

Number of Pins

n

Pitch

p

Top to Seating Plane

A

Ceramic Package Height

A2

Standoff

A1

Shoulder to Shoulder Width

E

Ceramic Pkg. Width

E1

Overall Length

D

Tip to Seating Plane

L

Lead Thickness

c

Upper Lead Width

B1

Lower Lead Width

B

Overall Row Spacing

eB

Window Width

W1

Window Length

W2

*Controlling Parameter

JEDEC Equivalent: MO-036

Drawing No. C04-010

MIN

.170

.155

.015

.300

.285

.880

.125

.008

.050

.016

.345

.130

.190

INCHES*

NOM

18

.100

.183

.160

.023

.313

.290

.900

.138

.010

.055

.019

.385

.140

.200

MAX

.195

.165

.030

.325

.295

.920

.150

.012

.060

.021

.425

.150

.210

MILLIMETERS

MIN

NOM

18

2.54

4.32

4.64

3.94

4.06

0.38

0.57

7.62

7.94

7.24

7.37

22.35

22.86

3.18

3.49

0.20

0.25

1.27

1.40

0.41

0.47

8.76

9.78

3.30

3.56

4.83

5.08

MAX

4.95

4.19

0.76

8.26

7.49

23.37

3.81

0.30

1.52

0.53

10.80

3.81

5.33

© 1999 Microchip Technology Inc.

DS40182C-page 97

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