STM32F030x4/6/8/C
Package characteristics
Figure 36. TSSOP20 - 20-pin thin shrink small outline
$
0).
)$%.4)&)#!4)/.
AAA #
!
B
% %
3%!4).'
0,!.%
#
!
!
E
C
MM
'!5'% 0,!.%
K
,
,
1. Drawing is not to scale.
9!?-%?6
Table 62. TSSOP20 - 20-pin thin shrink small outline package mechanical data
Symbol
millimeters
Min
Typ
Max
inches(1)
Min
Typ
A
-
1.2
-
-
0.0472
A1
0.05
-
0.15
0.002
-
0.0059
A2
0.8
1
1.05
0.0315
0.0394
0.0413
b
0.19
0.3
0.0075
-
0.0118
c
0.09
D(2)
6.4
6.5
0.2
0.0035
-
0.0079
6.6
0.252
0.2559
0.2598
E
6.2
6.4
6.6
0.2441
0.252
0.2598
E1(3)
4.3
4.4
4.5
0.1693
0.1732
0.1772
e
-
0.65
-
-
0.0256
-
L
0.45
0.6
0.75
0.0177
0.0236
0.0295
L1
-
1
-
-
0.0394
-
k
0.0°
-
8.0°
0.0°
-
8.0°
aaa
-
-
0.1
-
-
0.0039
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per
side.
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