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STP08DP05TTR(2007) 데이터 시트보기 (PDF) - STMicroelectronics

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STP08DP05TTR Datasheet PDF : 30 Pages
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STP08DP05
Figure 12. Power dissipation vs temperature package
Typical characteristics
Note:
The Exposed-Pad should be soldered to the PBC to realize the thermal benefits.
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