STM32F302VCT7TR 데이터 시트보기 (PDF) - STMicroelectronics

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STM32F302VCT7TR

ARM®-based Cortex®-M4 32b MCU+FPU, up to 256KB Flash+ 40KB SRAM, 2 ADCs, 1 DAC ch., 4 comp, 2 PGA, timers, 2.0-3.6 V

STMicroelectronics 

Electrical characteristics

STM32F302xB STM32F302xC

6.3

6.3.1

Operating conditions

General operating conditions

Table 24. General operating conditions

Symbol

Parameter

Conditions

Min

Max Unit

fHCLK

fPCLK1

fPCLK2

VDD

VDDA

VBAT

VIN

PD

TA

TJ

Internal AHB clock frequency

-

Internal APB1 clock frequency

-

Internal APB2 clock frequency

-

Standard operating voltage

-

Analog operating voltage

(OPAMP and DAC not used)

Analog operating voltage

(OPAMP and DAC used)

Must have a potential

equal to or higher than

VDD

Backup operating voltage

-

TC I/O

I/O input voltage

TTa I/O

FT and FTf I/O(1)

BOOT0

Power dissipation at TA =

81505°C°Cfofrorsusfufifxfix67o(2r )TA =

WLCSP100

LQFP100

LQFP64

LQFP48

Ambient temperature for 6

suffix version

Maximum power

dissipation

Low-power dissipation(3)

Ambient temperature for 7

suffix version

Maximum power

dissipation

Low-power dissipation(3)

Junction temperature range

6 suffix version

7 suffix version

0

72

0

36

MHz

0

72

2

3.6

V

2

3.6

V

2.4

3.6

1.65

3.6

V

–0.3 VDD+0.3

–0.3 VDDA+0.3 V

–0.3

5.5

0

5.5

-

500

-

488

mW

-

444

-

364

–40

85

°C

–40

105

–40

105

°C

–40

125

–40

105

°C

–40

125

1. To sustain a voltage higher than VDD+0.3 V, the internal pull-up/pull-down resistors must be disabled.

2. cIfhTaAraisctleorwisetric, sh)i.gher PD values are allowed as long as TJ does not exceed TJmax (see Section 7.5: Thermal

3. ISnelcotwio-npo7w.5e:rTdhisesrmipaatliochnasrtaactete,rTisAticcsa)n. be extended to this range as long as TJ does not exceed TJmax (see

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