STM32F301C6U6TR 데이터 시트보기 (PDF) - STMicroelectronics
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STM32F301C6U6TR
STMicroelectronics
STM32F301C6U6TR Datasheet PDF : 135 Pages
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Package information
STM32F301x6 STM32F301x8
Table 76. WLCSP49 recommended PCB design rules (0.4 mm pitch)
Dimension
Recommended values
Pitch
0.4
Dpad
260 µm max. (circular)
220 µm recommended
Dsm
300 µm min. (for 260 µm diameter pad)
PCB pad design
Non-solder mask defined via underbump allowed.
Device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
Figure 38. WLCSP49 marking example (package top view)
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1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.
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