ST6201LD3 데이터 시트보기 (PDF) - STMicroelectronics
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ST6201LD3
STMicroelectronics
ST6201LD3 Datasheet PDF : 100 Pages
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ST6200C/ST6201C/ST6203C
12.3 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only
as design guidelines in Figure 72 and Figure 73.
Recommended glue for SMD plastic packages:
s Heraeus: PD945, PD955
s Loctite: 3615, 3298
Figure 72. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
250
200
150
Temp. [°C]
100
50
80°C
PREHEATING
PHASE
5 sec
SOLDERING
PHASE
COOLING PHASE
(ROOM TEMPERATURE)
0
Time [sec]
20
40
60
80
100
120
140
160
Figure 73. Recommended Reflow Soldering Oven Profile (MID JEDEC)
250
200
150
Temp. [°C]
100
50
90 sec at 125°C
ramp up
2°C/sec for 50sec
Tmax=220+/-5°C
for 25 sec
150 sec above 183°C
ramp down natural
2°C/sec max
0
100
200
300
Time [sec]
400
89/100
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