M24M01-RMN6P 데이터 시트보기 (PDF) - STMicroelectronics

부품명

상세내역

제조사

M24M01-RMN6P

1-Mbit serial I²C bus EEPROM

STMicroelectronics 

M24M01-R M24M01-DF

Package information

Table 20. WLCSP- 8-bump, with BSC, 2.578 x 1.716 mm, wafer level chip scale

package outline (continued)

Symbol

millimeters

Min

Typ

Max

inches(1)

Min

Typ

Max

e3

-

0.500

-

F

-

0.425

-

G

-

0.789

-

aaa

-

0.110

-

bbb

-

0.110

-

ccc

-

0.110

-

ddd

-

0.060

-

eee

-

0.060

-

-

0.0197

-

-

0.0167

-

-

0.0311

-

-

0.0043

-

-

0.0043

-

-

0.0043

-

-

0.0024

-

-

0.0024

-

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

Figure 22. WLCSP- 8-bump, 2.578 x 1.716 mm, wafer level chip scale

package recommended footprint







1. Dimensions are expressed in millimeters.

(B:/&635B0B)3B9

DocID12943 Rev 14

41/47

46

Share Link: