STM32WB55VCQ6TR 데이터 시트보기 (PDF) - STMicroelectronics

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STM32WB55VCQ6TR

Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5 and 802.15.4 radio solution

STMicroelectronics 

STM32WB55xx STM32WB35xx

Package information

7.3

VFQFPN68 package information

VFQFPN68 is a 8 x 8 mm, 0.4 mm pitch, very thin fine pitch quad flat package.

PIN 1 IDENTIFIER

LASER MARKING

Figure 44. VFQFPN68 package outline

D

68 67

1

2

ddd C

A

A1

A2

E

E

(2X) 0.10 C

L

TOP VIEW

D2

SEATING

C

PLANE

SIDE VIEW

E2

2

1

PIN 1 ID

C 0.30 X 45'

68 67

e

BOTTOM VIEW

b

EXPOSED PAD AREA

B029_VFQFPN68_ME_V1

1. VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Packages No lead. Sawed

version. Very thin profile: 0.80 < A ≤ 1.00 mm.

2. The pin #1 identifier must be existed on the top surface of the package by using indentation mark or other

feature of package body. Exact shape and size of this feature is optional.

Symbol

A

A1

A3

b

D

D2

Table 104. VFQFPN68 mechanical data

millimeters

inches(1)

Min

Typ

Max

Min

Typ

0.80

0.90

1.00

0.0315

0.0354

0

0.02

0.05

0

0.0008

-

0.20

-

-

0.0008

0.15

0.20

0.25

0.0059

0.0079

7.85

8.00

8.15

0.3091

0.3150

6.30

6.40

6.50

0.2480

0.2520

Max

0.0394

0.0020

-

0.0098

0.3209

0.2559

DS11929 Rev 10

177/193

185

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