STM32WB55VC 데이터 시트보기 (PDF) - STMicroelectronics

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STM32WB55VC

Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5 and 802.15.4 radio solution

STMicroelectronics 

Package information

STM32WB55xx STM32WB35xx

7.4

UFQFPN48 package information

UFQFPN48 is a 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package.

Pin 1 identifier

laser marking area

D

Figure 47. UFQFPN48 outline

EE

T

D

Y

A

Seating

ddd

A1 plane

e

b

Detail Y

Exposed pad

area

D2

E2

1

C 0.500x45°

pin1 corner

48

Detail Z

L

R 0.125 typ.

1

Z

48

A0B9_ME_V3

1. Drawing is not to scale.

2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.

3. There is an exposed die pad on the underside of the UFQFPN package, it must be electrically connected to

the PCB ground.

180/193

DS11929 Rev 10

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