MAX3669(1999) 데이터 시트보기 (PDF) - Maxim Integrated

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MAX3669
(Rev.:1999)

+3.3V, 622Mbps SDH/SONET Laser Driver with Current Monitors and APC

Maxim Integrated 

+3.3V, 622Mbps SDH/SONET

Laser Driver with Current Monitors and APC

At +5V power supply, the headroom voltage for the

MAX3669 is significantly improved. In this case, it is

possible to achieve a modulation current of more than

50mA (using resistor pull-ups as shown in the Typical

Operating Circuit). The MAX3669 can also be DC-coupled

to a laser diode when operating at +5V supply; the volt-

age at OUT+ should be ≥ 2.0V for proper operation.

Wire Bonding Die

For high current density and reliable operation, the

MAX3669 uses gold metalization. Make connections to

the die with gold wire only, using ball-bonding tech-

niques. Wedge bonding is not recommended. Die-pad

size is 4 mils (100µm) square, and die thickness is 12

mils (300µm) mils.

Layout Considerations

To minimize inductance, keep the connections between

the MAX3669 output pins and LD as close as possible.

Pin Configuration

Optimize the laser diode performance by placing a

bypass capacitor as close as possible to the laser

anode. Use good high-frequency layout techniques

and multilayer boards with uninterrupted ground planes

to minimize EMI and crosstalk.

Laser Safety and IEC 825

Using the MAX3669 laser driver alone does not ensure

that a transmitter design is compliant with IEC 825. The

entire transmitter circuit and component selections must

be considered. Customers must determine the level of

fault tolerance required by their application, recognizing

that Maxim products are not designed or authorized for

use as components in systems intended for surgical

implant into the body, for applications intended to sup-

port or sustain life, or for any other application where the

failure of a Maxim product could create a situation

where personal injury or death may occur.

Chip Topography

TOP VIEW

VCC 1

VCC 2

DATA+ 3

DATA- 4

GND 5

VCC 6

BIASMON 7

MODMON 8

32 31 30 29 28 27 26 25

MAX3669

24 VCC

23 MD

22 GND

21 GND

20 VCC

19 OUT-

18 OUT+

17 VCC

9 10 11 12 13 14 15 16

GND

ENABLE

N.C.

GND

N.C.

VCC

FAIL

GND

N.C.

N.C.

GND

VCC

BIAS

VCC

BIASMAX

MODSET

GND

APCSET

N.C.

0.083"

GND

N.C.

(2.10mm)

GND

N.C.

CAPC

VCC

GND

TQFP

0.070"

(1.78mm)

Chip Information

TRANSISTOR COUNT: 1525

SUBSTRATE CONNECTED TO GND

______________________________________________________________________________________ 11

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