DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

STM32F103V8H6TR Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге
Компоненты Описание
производитель
STM32F103V8H6TR Datasheet PDF : 123 Pages
First Prev 101 102 103 104 105 106 107 108 109 110 Next Last
Package characteristics
STM32F103xC, STM32F103xD, STM32F103xE
6
Package characteristics
6.1
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 58. Recommended PCB design rules (0.80/0.75 mm pitch BGA)
Dpad
Dsm
Dpad
0.37 mm
Dsm
0.52 mm typ. (depends on solder mask
registration tolerance
Solder paste 0.37 mm aperture diameter
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
ai15469
106/123
Doc ID 14611 Rev 7

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]