STM32F407OGY6 Просмотр технического описания (PDF) - STMicroelectronics

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производитель

STM32F407OGY6

ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera

STMicroelectronics 

STM32F405xx, STM32F407xx

Package characteristics

Figure 76. WLCSP90 - 0.400 mm pitch wafer level chip size package outline

A1 ball location

D

e1

e

Detail A

E

Wafer back side

A2

A

Side view

Detail A

rotated by 90 °C

eee

Bump side

e

e2

G

F

A1

b

Seating plane

A0JW_ME

Table 90. WLCSP90 - 0.400 mm pitch wafer level chip size package mechanical data

Symbol

millimeters

Min

Typ

Max

inches(1)

Min

Typ

Max

A

0.520

0.570

0.620

0.0205

0.0224

0.0244

A1

0.165

0.190

0.215

0.0065

0.0075

0.0085

A2

0.350

0.380

0.410

0.0138

0.015

0.0161

b

0.240

0.270

0.300

0.0094

0.0106

0.0118

D

4.178

4.218

4.258

0.1645

0.1661

0.1676

E

3.964

3.969

4.004

0.1561

0.1563

0.1576

e

0.400

0.0157

e1

3.600

0.1417

e2

3.200

0.126

F

0.312

0.0123

G

0.385

0.0152

eee

0.050

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

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