PIC16F57T-I/SO(2004) Просмотр технического описания (PDF) - Microchip Technology
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PIC16F57T-I/SO Datasheet PDF : 90 Pages
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PIC16F5X
28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
E
E1
p
B
n
D
2
1
A
c
A2
f
A1
L
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
Number of Pins
Pitch
n
28
p
.026
28
0.65
Overall Height
A
-
-
.079
-
-
Molded Package Thickness
A2
.065
.069
.073
1.65
1.75
Standoff
A1
.002
-
-
0.05
-
Overall Width
E
.295
.307
.323
7.49
7.80
Molded Package Width
E1
.009
.209
.220
5.00
5.30
Overall Length
D
.390
.402
.413
9.90
10.20
Foot Length
L
.022
.030
.037
0.55
0.75
Lead Thickness
c
.004
-
.010
0.09
-
Foot Angle
f
0°
4°
8°
0°
4°
Lead Width
B
.009
-
.015
0.22
-
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-073
MAX
2.0
1.85
-
8.20
5.60
10.50
0.95
0.25
8°
0.38
2004 Microchip Technology Inc.
DS41213C-page 79
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