STM32L151V6H6T Просмотр технического описания (PDF) - STMicroelectronics

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STM32L151V6H6T

Ultra-low-power 32-bit MCU ARM®-based Cortex®-M3, 128KB Flash, 16KB SRAM, 4KB EEPROM, LCD, USB, ADC, DAC

STMicroelectronics 

STM32L151x6/8/B STM32L152x6/8/B

Package information

7.7

Thermal characteristics

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max × ΘJA)

Where:

• TA max is the maximum ambient temperature in ° C,

• ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,

• PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

• PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 71. Thermal characteristics

Symbol

Parameter

Thermal resistance junction-ambient

BGA100 - 7 x 7 mm

Thermal resistance junction-ambient

LQFP100 - 14 x 14 mm / 0.5 mm pitch

Thermal resistance junction-ambient

TFBGA64 - 5 x 5 mm

ΘJA Thermal resistance junction-ambient

LQFP64 - 10 x 10 mm / 0.5 mm pitch

Thermal resistance junction-ambient

LQFP48 - 7 x 7 mm / 0.5 mm pitch

Thermal resistance junction-ambient

UFQFPN48 - 7 x 7 mm / 0.5 mm pitch

Value

59

46

65

45

55

16

Unit

°C/W

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