STPCI01 查看數據表（PDF） - STMicroelectronics

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STPCI01

PC Compatible Embedded Microprocessor

STMicroelectronics 

MECHANICAL DATA

5.2 388-PIN PACKAGE THERMAL DATA

388-pin PBGA package has a Power Dissipation

Capability of 4.5W which increases to 6W when

used with a Heatsink.

Figure 5-4. 388-Pin PBGA structure

Structure in shown in Figure 5-4.

Thermal dissipation options are illustrated in Fig-

ure 5-5 and Figure 5-6.

Signal layers

Power & Ground layers

Thermal balls

Figure 5-5. Thermal dissipation without heatsink

Board

Ambient

Case

Junction

Board

Ambient

Junction

Board dimensions:

- 10.2 cm x 12.7 cm

Rca

- 4 layers (2 for signals, 1 GND, 1VCC)

6

6

The PBGA is centered on board

Rjc

Board

Case There are no other devices

Rjb

8.5

125

1 via pad per ground ball (8-mil wire)

40% copper on signal layers

Copper thickness:

Rba

Ambient

- 17µm for internal layers

- 34µm for external layers

Rja = 13 °C/W

Airflow = 0

Board temperature taken at the center balls

44/55

Issue 1.1

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