TYPICAL PERFORMANCE (cont’d)
INTERMODULATION DISTORTION vs POWER OUTPUT
SD4010
TEST CIRCUIT SCHEMATIC
Balun 1, 2 : 50Ω Coaxial Cable, λ/4 @ 860 MHz
C1, C4,
C11, C16 : 100µF, 50V Electrolytic
C2, C5,
C12, C15 : 10µF, 35V Tantalum
C3, C6, C7 C8,
C19, C20 : 75 pF Ceramic Chip, ATC B
C9, C18 : 0.4 - 2.5 pF Variable, JOHANSON Giga-trim
C10
: 2pF Ceramic Chip, ATC B
C17
: 5pF Ceramic Chip, ATC B
L1, L2 : 7 Turns, 0.12” I.D., #22 AWG (1:1)
L3, L4 : 5 Turns, 0.12” I.D., #22 AWG (1:1)
See Photomaster for Microstrip Lines
Board
Material: ROGERS Ultra-Lam Er = 2.55, Height = 0.030”,
2 oz. Cu.
3/5