STPS5L60RL 查看數據表（PDF） - STMicroelectronics
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STPS5L60RL Datasheet PDF : 12 Pages
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Package information
2
Package information
STPS5L60
• Epoxy meets UL94,V0
• Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1
SMB package information
Figure 15. SMB package outline
(
'
(
$
F
$
/
E
Table 5. SMB package mechanical data
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
L
0.75
1.50
0.030
0.059
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Doc ID8727 Rev 4
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