STPS1H100AF 查看數據表（PDF） - STMicroelectronics
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STPS1H100AF Datasheet PDF : 10 Pages
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STPS1H100
Characteristics
Figure 13.
Forward voltage drop versus
forward current (maximum values)
Figure 14.
Thermal resistance junction to
ambient versus copper surface
under each lead (Epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMB)
IFM(A)
100.00
10.00
1.00
Tj=125 °C
Tj=25 °C
0.10
VFM(V)
0.01
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Rth(j-a)(°C/W)
120
110
SMB
100
90
80
70
60
50
40
30
S(Cu)(cm²)
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 15.
Thermal resistance junction to
ambient versus copper surface
under each lead (Epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMA)
Rth(j-a)(°C/W)
140
130
SMA
120
110
100
90
80
70
60
50
40
30
S(Cu)(cm²)
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 16.
Thermal resistance junction to
ambient versus copper surface
under each lead (Epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMAflat)
Rth(j-a)(°C/W)
200
180
SMAflat
160
140
120
100
80
60
40
20
S(Cu)(cm²)
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
5/10
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