M24128-DRDWTP/K 查看數據表（PDF） - STMicroelectronics

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M24128-DRDWTP/K

128-Kbit serial I²C bus EEPROM

STMicroelectronics 

M24128-BW M24128-BR M24128-BF M24128-DF

9

Package information

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

For die information concerning the M24128 delivered in unsawn wafer, please contact your

nearest ST Sales Office.

9.1

UFDFPN5 (DFN5) package information

Figure 16. UFDFPN5 – 1.7x1.4 mm, 0.55 mm thickness, ultra thin fine pitch

dual flat package, no lead - package outline

'

N

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3LQ

E

(

(

3LQ

;

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H

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PDUNLQJVLGH

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1. On the bottom side, pin 1 is identified by the specific pad shape and, on the top side, pin 1 is defined from

the orientation of the marking: when reading the marking, pin 1 is below the upper left package corner.

Table 18. UFDFPN5 - 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch

dual flat package, no lead - package mechanical data

Symbol

millimeters

Min

Typ

Max

inches(1)

Min

Typ

Max

A

0.500

0.550

0.600

0.0197

0.0217

0.0236

A1

0.000

-

0.050

0.0000

-

0.0020

b(2)

0.175

0.200

0.225

0.0069

0.0079

0.0089

D

1.600

1.700

1.800

0.0630

0.0669

0.0709

D1

1.400

1.500

1.600

0.0551

0.0591

0.0630

E

1.300

1.400

1.500

0.0512

0.0551

0.0591

E1

0.175

0.200

0.225

0.0069

0.0079

0.0089

X

-

0.200

-

-

0.0079

-

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