P2101MB60TP 查看數據表（PDF） - Teccor Electronics

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P2101MB60TP

275 V, two-chip sidactor device

Teccor Electronics 

Package Dimensions

MS-013

The MS-013 is designed to meet mechanical standards as set forth in JEDEC publication

number 95.

K

J

1 FH

7 ˚ TYP

A

B

MOLD SPLIT LINE

D

C

PAD OUTLINE

E

[.138]

3.50

F

G

7 ˚ TYP

M

A

7 ˚ TYP

A

L

[.065]

1.65

[.059]

1.50

[.460]

11.68

BURR SIDE

X

W

96 ˚

4˚

P

MIN LENGTH

OF FLAT

U

N

T

7 ˚ TYP

R

0.08

DETAIL A

SCALE 20:1

Dimension

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

S

T

U

W

X

MIN

0.360

0.348

0.352

0.138

0.400

0.293

0.289

0.089

0.045

0.034

0.008

0.036

0.020

0.010

0.023

Inches

MAX

0.364

0.352

0.356

0.138

0.412

0.051

0.043

0.051

0.118

0.089

0.293

0.293

0.093

0.045

0.036

0.008

0.036

0.010

0.023

Millimeters

MIN

MAX

9.14

9.25

8.84

8.94

8.94

9.04

3.51

3.51

10.16

10.46

1.30

1.09

1.30

3.00

2.26

0.30

7.44

7.34

7.44

2.26

2.36

1.14

1.14

0.86

0.91

0.20

0.20

0.91

0.91

0.51

0.25

0.25

0.58

0.58

Notes:

• Dimensions and tolerances per ASME Y14.5M-1982

• Mold flash shall not exceed 0.13 mm per side.

• All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one

minute from leads to case over the operating temperature range)

http://www.teccor.com

+1 972-580-7777

6-6

© 2002 Teccor Electronics

SIDACtor® Data Book and Design Guide

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