AT24C02C-PHM-B 查看數據表（PDF） - Atmel Corporation
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AT24C02C-PHM-B
Atmel Corporation
AT24C02C-PHM-B Datasheet PDF : 23 Pages
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8U3-1 – VFBGA
Atmel AT24C02C
E
D
5. b
PIN 1 BALL PAD CORNER
TOP VIEW
PIN 1 BALL PAD CORNER
1
2
3
4
A1
A2
A
SIDE VIEW
d
(d1)
8
7
6
5
e
(e1)
BOTTOM VIEW
8 SOLDER BALLS
Notes:
1. This drawing is for general information only.
2. Dimension ‘b’ is measured at maximum solder ball diameter.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
SYMBOL
A
A1
A2
b
D
E
e
e1
d
d1
COMMON DIMENSIONS
(Unit of Measure - mm)
MIN NOM MAX NOTE
0.73 0.79 0.85
0.09 0.14 0.19
0.40 0.45 0.50
0.20 0.25 0.30 2
1.50 BSC
2.0 BSC
0.50 BSC
0.25 REF
1.00 BSC
0.25 REF
TITLE
Package Drawing Contact: 8U3-1, 8-ball, 1.50 x 2.00mm Body,
packagedrawings@atmel.com 0.50 pitch, VFBGA Package (dBGA2)
GPC
07/14/10
DRAWING NO. REV.
GXU
8U3-1
D
21
8700D–SEEPR–8/10
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