FDC37M60X 查看數據表（PDF） - SMSC -> Microchip

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FDC37M60X

Enhanced Super I/O Controller with Infrared Support

SMSC -> Microchip 

D

D1

E

E1

e

W

A

A2

H

0.10

-C-

A1

DIM

A

A1

A2

D

D1

E

E1

H

L

L1

e

0

W

TD(1)

TE(1)

TD(2)

TE(2)

MIN

MAX

2.80

3.15

0.1

0.45

2.57

2.87

23.4

24.15

19.9

20.1

17.4

18.15

13.9

14.1

0.1

0.2

0.65

0.95

1.8

2.6

0.65 BSC

0°

12°

.2

.4

21.8

22.2

15.8

16.2

22.21

22.76

16.27

16.82

TD/TE

MIN

MAX

.110

.124

.004

.018

.101

.113

.921

.951

.783

.791

.685

.715

.547

.555

.004

.008

.026

.037

.071

.102

.0256 BSC

0°

12°

.008

.016

.858

.874

.622

.638

.874

.896

.641

.662

0

L

L1

Notes:

1) Coplanarity is 0.100mm (.004") maximum.

2) Tolerance on the position of the leads is

0.200mm (.008") maximum.

3) Package body dimensions D1 and E1 do not

include the mold protrusion. Maximum mold

protrusion is 0.25mm (.010").

4) Dimensions TD and TE are important for testing

by robotic handler. Only above combinations of (1)

or (2) are acceptable.

5) Controlling dimension: millimeter. Dimensions

in inches for reference only and not necessarily

accurate.

FIGURE 23 - 100 PIN QFP PACKAGE OUTLINE

179

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