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QL3012-0PB456M 查看數據表(PDF) - QuickLogic Corporation

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QL3012-0PB456M Datasheet PDF : 49 Pages
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pASIC 3 FPGA Family Data Sheet Rev. D
Packaging Information
The pASIC 3 product family packaging information is presented in Table 32.
NOTE: Military temperature range plastic packages will be added as follow on products to the commercial
and industrial products.
Table 32: Packaging Options
Device
Information
QL3004
Pin Pitch
QL3004E
Pin Pitch
QL3006
Pin Pitch
Device
QL3012
Pin Pitch
68 PLCC 0.05 in. 68 PLCC 0.05 in. 68 PLCC 0.05 in. 84 PLCC 0.05 in.
84 PLCC 0.05 in. 84 PLCC 0.05 in. 84 PLCC 0.05 in.
Package
Definitionsa
100
TQFP
0.5 mm
100
TQFP
0.5 mm
100
TQFP
0.5 mm
100
TQFP
144
TQFP
0.5 mm
0.5 mm
-
-
-
-
-
-
-
-
QL3025
QL3040
QL3060
Pin
Pin Pitch Pin Pitch Pitch
100
TQFP
0.5 mm
208
PQFP
0.5 mm
208
PQFP
0.5 mm
144
TQFP
0.5 mm
456
PBGA
1.27 mm
456
PBGA
1.27 mm
208
PQFP
0.5 mm
-
-
-
-
256
PBGA
1.27 mm
-
-
-
-
a. PLCC
PQFP
PBGA
TQFP
= Plastic Leaded Chip Carrier
= Plastic Quad Flat Pack
= Plastic Ball Grid Array
= Thin Quad Flat Pack
Ordering Information
QL
3060
-1
PQ208
C
QuickLogic Device
Part Number:
3004, 3004E, 3006, 3012
3025, 3040, 3060
Speed Grade:
Operating Range:
C = Commercial
I = Industrial
M = Military
0 - Quick
1 - Fast
2 - Faster
3 - Faster
4 - Wow**
Package Code:
PL68 = 68-pin PLCC
PF84 = 84-pin PLCC
PF100 (PFN100)* = 100-pin TQFP
PF144 (PFN144)* = 144-pin TQFP
PQ208 (PQN208)*= 208-pin PQFP
PB256 (PBN256)*= 256-ball PBGA
PB456 (PBN456)*= 456-ball PBGA
* Lead-free packaging is available, contact QuickLogic regarding availability (see Contact Information).
** Contact QuickLogic regarding availability (see Contact Information)
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www.quicklogic.com
© 2005 QuickLogic Corporation

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