M69KB096AB80DW8 查看數據表（PDF） - STMicroelectronics
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M69KB096AB80DW8
STMicroelectronics
M69KB096AB80DW8 Datasheet PDF : 73 Pages
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10 Wafer and die specifications
M69KB096AB
Table 25.
Pad
Bond Pad Location and Identification
Signal
X (µm)(1)
Pad Coordinates from Center of Die
Y (µm)(1)
X (inches) (1)
1
A0
2
A1
3
A2
4
A3
5
A4
6
A5
7
VCCQ
8
VSSQ
9
A6
10
A7
11
A17
12
A18
13
A19
14
E
15
LB
16
UB
17
CR
18
L
19
W
20
K
21
VCC
22
VSS
23
A20
24
A21
25
DNU(2)
26
A8
27
A9
28
VSSQ
29
VCCQ
30
A10
31
A11
32
A12
33
A13
-2,281.70
-2,162.70
-2,043.70
-1,924.70
-1,805.70
-1,686.70
-1,567.70
-1,448.70
-1,329.70
-1,210.70
-1,091.70
-972.70
-853.70
-734.70
-615.70
-496.70
-377.70
-258.70
-139.70
135.79
376.17
495.17
614.17
733.17
852.17
971.17
1,090.17
1,209.17
1,328.17
1,447.17
1,566.17
1,685.17
1,804.17
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
2,342.81
-0.0898306
-0.0851456
-0.0804605
-0.0757755
-0.0710905
-0.0664054
-0.0617204
-0.0570353
-0.0523503
-0.0476653
-0.0429802
-0.0382952
-0.0336101
-0.0289251
-0.0242401
-0.0195550
-0.0148700
-0.0101849
-0.0054999
0.0053460
0.0148097
0.0194948
0.0241798
0.0288649
0.0335499
0.0382349
0.0429200
0.0476050
0.0522901
0.0569751
0.0616601
0.0663452
0.0710302
Y (inches)(1)
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
0.0922367
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