MCP4011T-503E_MC 查看數據表（PDF） - Microchip Technology

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MCP4011T-503E_MC

Low-Cost 64-Step Volatile Digital POT

Microchip Technology 

MCP4011/2/3/4

8-Lead Plastic Dual-Flat No-Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

NOTE 1

12

TOP VIEW

e

b

N

L

K

E

E2

EXPOSED PAD

21

D2

BOTTOM VIEW

NOTE 1

A

A3

A1

NOTE 2

Units

Dimension Limits

Number of Pins

N

Pitch

e

Overall Height

A

Standoff

A1

Contact Thickness

A3

Overall Length

D

Overall Width

E

Exposed Pad Length

D2

Exposed Pad Width

E2

Contact Width

b

Contact Length §

L

Contact-to-Exposed Pad §

K

MILLIMETERS

MIN

NOM

8

0.50 BSC

0.80

0.90

0.00

0.02

0.20 REF

2.00 BSC

3.00 BSC

1.30

—

1.50

—

0.18

0.25

0.30

0.40

0.20

—

MAX

1.00

0.05

1.75

1.90

0.30

0.50

—

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. § Significant Characteristic

4. Package is saw singulated

5. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing No. C04–123, Sept. 8, 2006

DS21978C-page 52

© 2006 Microchip Technology Inc.

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