NXP Semiconductors
12. Package outline
P89LPC932A1
8-bit microcontroller with accelerated two-clock 80C51 core
PLCC28: plastic leaded chip carrier; 28 leads
SOT261-2
eD
y
X
25
26
28
1
4
β
k
pin 1 index
5
e
D
HD
19
A
18 Z E
E HE
e
12
11
vM A
ZD
B
vM B
eE
bp
b1
wM
A
A4 A1
Lp
detail X
(A 3)
0
5
10 mm
scale
DIMENSIONS (mm dimensions are derived from the original inch dimensions)
UNIT A
A1
min.
A3
A4
max.
bp
b1 D(1) E(1)
e
eD eE HD HE
k
Lp
v
w
y
ZD(1) ZE(1)
max. max.
β
mm
4.57
4.19
0.51
inches
0.180
0.165
0.02
0.25
0.01
3.05
0.53
0.33
0.81
0.66
11.58 11.58
11.43 11.43
1.27
10.92 10.92 12.57 12.57
9.91 9.91 12.32 12.32
1.22
1.07
1.44
1.02
0.18
0.18
0.1
2.16 2.16
45 o
0.12
0.021 0.032 0.456 0.456
0.013 0.026 0.450 0.450
0.05
0.43
0.39
0.43
0.39
0.495
0.485
0.495
0.485
0.048
0.042
0.057
0.040
0.007 0.007
0.004
0.085
0.085
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT261-2
IEC
112E08
REFERENCES
JEDEC
JEITA
MS-018
EDR-7319
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
01-11-15
Fig 29. Package outline SOT261-2 (PLCC28)
P89LPC932A1_3
Product data sheet
Rev. 03 — 12 March 2007
© NXP B.V. 2007. All rights reserved.
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