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PIC16LC924-08/CL 查看數據表(PDF) - Microchip Technology

零件编号
产品描述 (功能)
生产厂家
PIC16LC924-08/CL
Microchip
Microchip Technology 
PIC16LC924-08/CL Datasheet PDF : 189 Pages
First Prev 171 172 173 174 175 176 177 178 179 180 Next Last
PIC16C9XX
19.4 Package Marking Information
68-Lead CERQUAD Windowed
Example
MMMMMMMMMMMMMMMMM
AABBCDE
64-Lead TQFP
MMMMMMMMMM
MMMMMMM
AABBCDE
68-Lead PLCC
PIC16C924-04/CL
9650CAE
Example
PIC16C923
-08I/PT
9712CAE
Example
MMMMMMMMMM
MMMMMMM
AABBCDE
64-Lead SDIP (Shrink DIP)
MMMMMMMMMMMMMMMMM
AABBCDE
PIC16C924
-08/L
9648CAE
Example
PIC16C924-04I/SP
9736CAE
Legend:
MM...M
XX...X
AA
BB
C
D1
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
S = Tempe, Arizona, U.S.A.
Mask revision number for microcontroller
Assembly code of the plant or country of origin in which
part was assembled.
Note:
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
DS30444E - page 174
© 1997 Microchip Technology Inc.

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