PIC16F628A-I/SO 查看數據表（PDF） - Microchip Technology

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PIC16F628A-I/SO

Flash-Based, 8-Bit CMOS Microcontrollers with nanoWatt Technology

Microchip Technology 

PIC16F627A/628A/648A

18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

NOTE 1

E

E1

1 23

e

b

α

h

h

c

A

A2

φ

β

A1

L

L1

Units

MILLIMETERS

Number of Pins

Pitch

Dimension Limits

MIN

N

e

NOM

18

1.27 BSC

MAX

Overall Height

Molded Package Thickness

Standoff §

Overall Width

A

–

–

2.65

A2

2.05

–

–

A1

0.10

–

0.30

E

10.30 BSC

Molded Package Width

Overall Length

Chamfer (optional)

E1

7.50 BSC

D

11.55 BSC

h

0.25

–

0.75

Foot Length

L

0.40

–

1.27

Footprint

L1

1.40 REF

Foot Angle

φ

0°

–

8°

Lead Thickness

c

0.20

–

0.33

Lead Width

b

0.31

–

0.51

Mold Draft Angle Top

α

5°

–

15°

Notes:

Mold Draft Angle Bottom

β

5°

–

15°

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-051B

© 2007 Microchip Technology Inc.

DS40044F-page 163

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