P1202ZC62TP 查看數據表（PDF） - Teccor Electronics

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P1202ZC62TP

100 mA, battrax quad negative SLIC protector

Teccor Electronics 

SIDACtor Soldering Recommendations

not exceed 275 °C and the maximum temperature of the plastic body does not exceed

250 °C. (Figure 5.8)

Transport

Vapor lock

(secondary

medium)

Vapor phase

zone

Boiling liquid (primary medium)

Figure 5.7 Principle of Vapor Phase Soldering

Cooling pipes

PC board

Heating

elements

260 Pre-heat

240

220

Soak

Peak Temperature

220 ˚C - 245 ˚C

Reflow

Cool

Down

200

180

160

0.5 - 0.6 ˚C/s

1.3 - 1.6 ˚C/s

<2.5 ˚C/s

140

120

100 <2.5 ˚C/s

Soaking Zone

60 - 90 s typical

( 2 min. MAX )

Reflow Zone

30 - 60 s typical

( 2 min. MAX )

80

Pre-heating Zone

60

( 2-4 min MAX )

40

20

0

0 30

60 90 120 150 180 210 240 270 300

Time (Seconds)

Figure 5.8 Reflow Soldering Profile

During reflow, the surface tension of the liquid solder draws the leads of the device towards

the center of the soldering area, correcting any misalignment that may have occurred

during placement and allowing the device to set flush on the pad. If the footprints of the pad

are not concentrically aligned, the same effect can result in undesirable shifts as well.

Therefore, it is important to use a standard contact pattern which leaves sufficient room for

self-positioning.

After the solder cools, connections should be visually inspected and remnants of the flux

removed using a vapor degreaser with an azeotrope solvent or equivalent.

© 2002 Teccor Electronics

SIDACtor® Data Book and Design Guide

5 - 23

http://www.teccor.com

+1 972-580-7777

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