PIC12F609T-I/P 查看數據表（PDF） - Microchip Technology

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PIC12F609T-I/P

8-Pin Flash-Based, 8-Bit CMOS Microcontrollers

Microchip Technology 

PIC12F609/615/617/12HV609/615

16.9 Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +125°C

Param

No.

Sym

Characteristic

Typ

Units

Conditions

TH01 JA

Thermal Resistance

Junction to Ambient

TH02 JC

Thermal Resistance

Junction to Case

84.6*

149.5*

211*

60*

44*

41.2*

39.9*

39*

9*

3.0*

C/W 8-pin PDIP package

C/W 8-pin SOIC package

C/W 8-pin MSOP package

C/W 8-pin DFN 3x3mm package

C/W 8-pin DFN 4x4mm package

C/W 8-pin PDIP package

C/W 8-pin SOIC package

C/W 8-pin MSOP package

C/W 8-pin DFN 3x3mm package

C/W 8-pin DFN 4x4mm package

TH03

TH04

TH05

TH06

TH07

*

Note 1:

2:

TDIE

Die Temperature

150*

C

PD

Power Dissipation

—

W PD = PINTERNAL + PI/O

PINTERNAL Internal Power Dissipation

—

W PINTERNAL = IDD x VDD

(NOTE 1)

PI/O

I/O Power Dissipation

—

W PI/O =  (IOL * VOL) +  (IOH * (VDD -

VOH))

PDER

Derated Power

—

W PDER = PDMAX (TDIE - TA)/JA

(NOTE 2)

These parameters are characterized but not tested.

IDD is current to run the chip alone without driving any load on the output pins.

TA = Ambient temperature.

DS41302D-page 154

 2010 Microchip Technology Inc.

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